click here for the pdf flyer
DTIP'2024 will be the 26th anniversary edition of the Conference on
Design, Test, Integration & Packaging of MEMS and MOEMS. This
unique event brings together participants interested in MEMS/MOEMS
processing and those interested in design tools and methods to
facilitate the design of MEMS/MOEMS. All aspects including design,
modeling, testing, micro-machining, integration and packaging of
structures, devices and systems are addressed in two main Conferences,
Special Sessions and Invited Talks. Accepted papers will be submitted
for possible inclusion into IEEE Xplore subject to meeting IEEE
Xplore’s scope and quality requirements
Paper Submission Deadline: February 27th, 2026.
Notification of Acceptance: April 10th, 2026.
Early bird registration: April 6th, 2026.
Camera ready submission: May 29th, 2026.
DTIP aims to present the latest research in “Design, Integration, Test and Packaging of MEMS and MOEMS”. A program committee composed with international experts in their field will review all submitted papers. A program committee composed with international experts in their field will review all submitted papers.
Expected DTIP 2026 submissions are 4-6 pages papers
2-3 pages abstracts will be accepted for poster
contributions
Special sessions and tutorials
Feel free to propose a special session or a tutorial topic by email (dtip@dtip-mems.org) at your earliest convenience.
The symposium program will include plenary sessions with invited talks and/or technical panels. Feel free to propose topics to be addressed and/or to nominate colleagues for an invited talk.
