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Paris, France, May 31st - June 3rd, 2026 (in person only event)
       


Chairs

  • General Chair:
    Emile Martincic, Univ. Paris-Saclay
  • Publication Chair:
  • Corinne Dejous, Univ. Bordeaux
  • Technical Program Chairs:
  • Peter Schneider, Fraunhofer IIS/EAS, Germany
Abdelkrim Talbi, Ecole Centrale Lille 
  • Local Chairs:
Alexis Brenes, Univ. Paris-Saclay
Jean Gamby, CNRS-C2N
Gilgueng Hwang, CNRS-C2N

Contact information

What's new?

  • Nov. 20th, 2025: 1st announcement
  •                              and save the date 
  • Dec. 10th, 2025: Call for papers 
  • Jan. 5th, 2026: submision website available
  •  

ABOUT DTIP

DTIP'2026 will be the 28th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in a single track Conference. After the successful 2025 edition in Split, the 2026 edition will take place in the city of Paris, France. 

We look forward to meeting you in Paris ...

Emile Martincic







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