DTIP logo - Split seaside view
Paris, France, May 31st - June 3rd, 2026
 IEEE logo
Steering Committee

The Steering Committee of DTIP oversees the long-term planning and success of current instances of the Symposium; plans for future conferences in the series; evaluates how well each conference has achieved its objectives; and proposes and implements improvements to continuously meet these objectives.
The Steering Committee is responsible for making strategic decisions, including but not limited to: the appointment of the Local Organization Chair and Technical Program Chairs (including removal and reappointment if necessary); providing guidance, oversight, and support for the Executive Committees of instances of the conference; selection of conference dates and locations; determining the major theme of the conference; coordination amongst partners; creation or approval of any conference specific policies; enforcement of ethical policies; and reviewing the budget. 

Steering Committee composition:

  • Alain BOSSEBOEUF, IEF/CNRS-Université Paris-Sud, France
  • Elie LEFEUVRE, Université Paris Sud - CNRS, France
  • Yoshio MITA, The University of Tokyo, Japan
  • Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany
  • Abdelkrim TALBI, Ecole Centrale de Lille, France.


  • Technical Program Committee
    • Chairs: 
    • Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany
    • Abdelkrim TALBI, Ecole Centrale Lille, France
    Alexis Brenes, Univ. Paris-Saclay, France
    Jean Gamby, CNRS-C2N, France
    Gilgueng Hwang, CNRS-C2N, France

    Program Committee
    Amakawa    Shuhei,    Hiroshima University, Japan
    Bartolucci, Giancarlo, University of Roma, Italy
    BOSSEBOEUF Alain, C2N/CNRS-University Paris-Saclay, France
    Brenes    Alexis, Université Paris-Saclay    France
    CAMPANELLA Humberto, Silicon Austria Labs, Austria
    Capraro    Stephane, Laboratoire Hubert Curien, France
    Chuang    Wan-Chun, National Cheng Kung University, Taiwan
    Cismaru    Alina, IMT - Bucharest, Romania
    Elfadel    Ibrahim, Khalifa University, United Arab Emirates
    Farrugia Russell, University of Malta, Malta
    Flandre    Denis, UCLouvain, Belgium
    Garcia-Souto Jose, University Carlos III of Madrid, Spain
    JOUBERT    Pierre-Yves, Universite Paris-Saclay, France
    Komatsu    Satoshi, Tokyo Denki University, Japan
    Lagosh    Anton, Silicon Austria Labs, Austria
    Lefeuvre Elie, University of Paris-Saclay, France
    Li Tie, Shanghai Institute of Microsystem and Information Technology, China
    Lissorgues Gaelle, ESIEE Paris - Univ G EIFFEL, France
    Marcelli Romolo, CNR, Italy
    MEHNER Jan , TU Chemnitz, Germany   
    MITA Yoshio, Univ. of Tokyo, Japan
    Mohammed Zakriya, New York University-Tandon School of Engineering, United States
    PETER Yves-Alain, Polytechnique Montreal, Canada
    Plesz Balazs, Budapest University of Technology and Economics, Hungary
    SANSA Marc, CEA-Leti, Université Grenoble Alpes, France
    Sardi Giovanni Maria,CNR-IMM, Italy
    Sasaki Takashi, Silicon Austria Labs, Austria
    Savino Alessandro, Politecnico di Torino, Italy
    Sayar Ärani Farid, Sabanci University, Turkey
    Tounsi Fares, UCLouvain, Belgium
    ZHU Jian, Nanjing Electronic Devices Institute, China




    some text