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Paris - France, May 12th - May 15th, 2019
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DTIP2019 – Paris, France – May 12th to May 15th, 2019
Don’t miss the premier European scientific event on Microsystems, MEMS and MOEMS >> Save the date!!!

To provide faster dissemination of cutting-edge results, the chairs of DTIP’2019 have decided to introduce a “Last Minute Papers” submission process on this 20th anniversary edition of DTIP. Selection of papers will be based on 4-6 pages, camera-ready papers. Accepted papers will be published as-is in the proceedings, after correction of small typos, and will be handled as standard submissions (oral or poster presentation, special issue invitation).
Templates can be found on
Please make sure to use only A4 templates.
Specific deadlines for “Last Minute Papers”
Submission of camera-ready papers (4 to 6 pages, IEEE Format) before March, 5th (see instructions @,
Notification of acceptance before March, 29th,
Final papers upload camera-ready papers (4 to 6 pages, IEEE Format) before April, 5th.
Due to the tight schedule, no deadline extension will be granted.

>>>> Access to Paper Submission Website

Expired deadlines
Research paper submission
DTIP aims to present the latest research in “Design, Integration, Test and Packaging of MEMS and MOEMS”. A program committee composed with international experts in their field will review all submitted papers. Even if abstracts of about 600 words will be considered, it is recommended to submit extended abstracts (up to 1500 words) plus one page of figures for efficient and fair scientific reviewing. Detailed instructions regarding electronic submissions will be posted on the Authors Information page.

>>>> Access to Paper Submission Website

Product-oriented papers
Companies that want to advertise their products (such as sensors, equipment or CAD tools) are discouraged to submit a research paper if there is no revelation of any scientific contribution or rupture with respect to the state-of-the-art. In that case, it is recommended to consider becoming an exhibitor at the conference to benefit from a large audience (an oral presentation in a plenary session and a stand).
Questions may be directed in the meantime by e-mail (

Special session on “MEMS devices in standard processes”
The demand and variety of applications for MEMS sensors has been growing steadily. Quick and efficient design has become increasingly important. However, the strong interaction of product design and manufacturing processes remains a major challenge. Fast MEMS product development is only possible through innovative design concepts and the provision of modular process building blocks. A deep understanding of the interrelationships and the development of corresponding simulation tools are crucial. Integrated device manufacturers make more and more reuse of their developed technologies. MEMS foundries provide validated process blocks or even complete process flows. Does the golden MEMS rule formulated by Yole Developpement ‘One product – one process’ continue to apply?  Are we ready to design novel MEMS devices in standard processes? To answer these questions, we ask for contributions that demonstrate novel designs in established processes. 
Organizer: Gerold Schropfer - - Coventor Inc.

Specific deadlines for special sessions:
Submission of extended abstracts (1500 words plus figures) before January, 13th,
Notification of acceptance before February, 15th,
Final papers (up to 6 pages, IEEE Format) before April, 5th.
>>>> Access to Paper Submission Website

For those of you, who intend to propose a special session, feel free to propose a topic by email ( at your earliest convenience. When proposing a special session, please mention how many submissions are expected. Once selected by the chairs of the symposium, special session organizers will be responsible for attracting papers, organizing the review and making the final selection with the support of the DTIP organization.
Please refer to the program of past editions to have an overview of previous special sessions.

Invited talks and panels

The symposium program will include three plenary sessions with invited talks and/or technical panels. Feel free to propose topics to be addressed and/or to nominate colleagues for an invited talk by email ( at your earliest convenience.

Looking forward to have you on-board for this 20th anniversary edition of DTIP,
Jérôme Juillard and Elie Lefeuvre, Local Organization co-Chairs
Yoshio Mita, Francis Pressecq, Peter Schneider and Stewart Smith, Conference Program co-Chairs
Frédérick Mailly, Publication Chair
Pascal Nouet, General Chair

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