Computer-Aided Design, Design and Test

 

• Chair: Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany


• Co-Chair: Francis Pressecq, CNES, France

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.

Topics of Interest

CAD: Integrated CAD/CAE tools, languages and interchange of data, MEMS/MOEMS libraries and IP, Modelling and simulation of fabrication processes, Structured design methodologies, System-level design methodologies

DESIGN: Mechanical simulation, Model order reduction, Multi-physics & Multi-domain simulations, Numerical simulation, other design issues, Signal processing & Front-ends, Thermal evaluation

TEST: Failure mechanisms, Fault modelling, Fault simulation and test pattern generation, Yield estimation

DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

Technical Program Committee

• Mehdi AZADMEHR, HBV Buskerud and Vestfold University College, Norway
• Giancarlo BARTOLUCCI, University of Roma Tor Vergata, Italy
• Corina BIRLEANU, Technical University of Cluj-Napoca, Romania
• Henri CAMON, LAAS-CNRS, France
• Benoit CHARLOT, IES, CNRS/University of Montpellier, France
• Kuo-Shen CHEN, National Cheng-Kung University, Taiwan
• Franck CHOLLET, Inst. FEMTO-ST / Univ. Franche-Comté, France
• Giorgio DE PASQUALE, DIMEAS, Politecnico di Torino, Italy
• Péter FURJES, Institute for Tech. Physics and Materials Science, Hungary
• Dimitri GALAYKO, Pierre and Marie Curie Univ., Paris VI, France
• Jerome JUILLARD, Supélec, France
• Laurent LATORRE, LIRMM, University of Montpellier, France
• Raphaël LEVY, ONERA, France
• Holden LI, NTU, school of Mechanical and Aerospace, Singapore
• Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
• Frédérick MAILLY, LIRMM, University of Montpellier, France
• Jan MEHNER, TU Chemnitz, Germany
• Andrew RICHARDSON, Lancaster University, UK
• Bart ROMANOWICZ, Nano Science & Technology Institute, Austin, USA
• Gabriele SCHRAG, TU Munich, Germany
• Gerold SCHROPFER, Coventor, France
• Vladimir SOBOLEV, South Dakota School of Mines and Technology, USA
• Aurelio SOMA, Politecnico di Torino, Italy
• Ralf SOMMER, TU Ilmenau, Germany
• Guillermo VILLANUEVA, EPFL, Switzerland

Microfabrication, Integration and Packaging
 

• Chair: Stewart Smith, The University of Edinburgh, Scotland


• Co-Chair: Yoshio Mita, The University of Tokyo, Japan

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.

Topics of Interest

MICROFABRICATION:  assembly technologies,  microlithography issues for MEMS/MOEMS,  micromachining, micro-molding, nano-imprint, embossing,  others
INTEGRATION: flexible technologies and printed electronics, co-integration between MEMS and electronics, 3D technologies

PACKAGING: MOEMS, RF and microwave, vacuum and other harsh environments, others

MATERIALS: piezoelectric, PDMS, others

CHARACTERIZATION: dimensional measurements, non-destructive evaluation, PCM & test structures, physical measurements, reliability and failure analysis

DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

Technical Program Committee

• Knut AASMUNDTVEIT, HBV Buskerud and Vestfold University College, Norway
• Shuhei AMAKAWA, Hiroshima University, Japan
• Arturo AYON, Univ. of Texas at San Antonio, USA
• Steeve BEEBY, University of Southampton, UK
• Alain BOSSEBOEUF, IEF/CNRS-Université Paris-Sud, France
• Victor BRIGHT, Univ. of Colorado Boulder, USA
• Stéphane CAPRARO, laboratoire Hubert Curien, Saint Etienne, France
• Virginia CHU, INESC MN, Portugal
  
• Olivier Français, SATIE, France
• Alexandra GARRAUD, University of Florida, USA
• Kun GENG, Google Inc. / Waymo, Mountain View, CA, USA
• Dooyoung HAH, Abdullah Gul University, Turkey
• Hamida HALLIL, IMS-University of Bordeaux, France
• Kazuhiro HANE, Sendai University, Japan, Japan
• Sébastien HENTZ, CEA, France
• Akio HIGO, The University of Tokyo, Japan
• Kristin IMENES, HBV, Norway
• Elie LEFEUVRE, Université Paris Sud - CNRS, France
• Tie LI, SIMIT, CAS, China
• Romolo MARCELLI, CNR-IMM Roma, Italy
• Mohamed MASMOUDI, University of Sfax, Tunisia
• Souhil MEGHERBI, IEF/CNRS-Université Paris-Sud, France
• Johan MOULIN, Univ. Paris Sud, France
• Raluca MULLER, IMT - Bucharest, Romania
• Claude PELLET, IMS-University of Bordeaux, France
• Yves-Alain PETER, EPM, Montréal, Canada
• Emanuela PROIETTI, CNR-IMM Roma, Italy
• Marta RENCZ, BME, Budapest, Hungary
• Libor RUFER, University of Grenoble, France
• Giovanni SARDI, CNR - IMM, Italy
• Xuechuan SHAN, SIMTech, Singapore
  
• Niels TAS, MESA+ Institute for Nanotechnology, Netherlands
• Eng Hock (Francis) TAY, National Univ. of Singapore, Singapore
• Russel TORAH, University of Southampton, UK
• John TUDOR, University of Southampton, UK
• R. Michael VAN DAM, UCLA, USA
• Dong F. WANG, Jilin Univ., Changchun, China
• Gou-Jen WANG, National Chung-Hsing University, Taiwan
• Zhenfeng WANG, SIMTech, Singapore
• Matthias WORGULL, KIT, Karlsruhe, Germany
• Hsiharng YANG, National Chung Hsing Univ., Taiwan
• Jian ZHU, Nanjing Electronic Devices Institute, China
• Christian A. ZORMAN, Case Western Reserve Univ., Cleveland, USA