Computer-Aided Design, Design and Test

 

• Chair: Peter Schneider, Fraunhofer IIS/EAS, Dresden, Germany


• Co-Chair: Francis Pressecq, CNES, France

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.

Topics of Interest

CAD: Integrated CAD/CAE tools, languages and interchange of data, MEMS/MOEMS libraries and IP, Modelling and simulation of fabrication processes, Structured design methodologies, System-level design methodologies

DESIGN: Mechanical simulation, Model order reduction, Multi-physics & Multi-domain simulations, Numerical simulation, other design issues, Signal processing & Front-ends, Thermal evaluation

TEST: Failure mechanisms, Fault modelling, Fault simulation and test pattern generation, Yield estimation

DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators




Technical Program Committee

• Shuhei AMAKAWA, Hiroshima University, Japan
• Giancarlo BARTOLUCCI, University of Roma Tor Vergata, Italy
• Steeve BEEBY, University of Southampton, UK
• Elena BLOKHINA, University College Dublin, Ireland
• Benoit CHARLOT, IES, CNRS/University of Montpellier, France
• Olivier FRANÇAIS, SATIE, France
• Jerome JUILLARD, Supélec, France
• Raphaël LEVY, ONERA, France
• Frédérick MAILLY, LIRMM, University of Montpellier, France
• Romolo MARCELLI, CNR-IMM Roma, Italy
• Claude PELLET, IMS, Université de Bordeaux, France
• Paul POP, Technical Univ. of Denmark, Lyngby, Denmark
• Andras POPPE, Mentor Graphics , Hungary
• Andrew RICHARDSON, Lancaster University, UK
• Bart ROMANOWICZ, Nano Science & Technol. Inst., Austin, USA
• Libor RUFER, University of Grenoble, France
• Gabriele SCHRAG, TU Munich, Germany
• Gerold SCHROPFER, Coventor, France
• Mahnaz SHAMSHIRSAZ, Amirkabir University of Technology, Iran
• Aurelio SOMA, Politecnico di Torino, Italy
• Xuming ZHANG, Hong Kong Polytechnic university, Hong-Kong
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Microfabrication, Integration and Packaging
 

• Chair: Yoshio Mita, University of Tokyo, Japan


• Co-Chair: Stewart Smith, The University of Edinburgh, Scotland

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.

Topics of Interest

• MICROFABRICATION:  assembly technologies,  microlithography issues for MEMS/MOEMS,  micromachining, micro-molding, nano-imprint, embossing,  others

INTEGRATION: flexible technologies and printed electronics, co-integration between MEMS and electronics, 3D technologies

PACKAGING: MOEMS, RF and microwave, vacuum and other harsh environments, others

MATERIALS: piezoelectric, PDMS, others

CHARACTERIZATION: dimensional measurements, non-destructive evaluation, PCM & test structures, physical measurements, reliability and failure analysis

DEVICES & COMPONENTS: RF MEMS, MOEMS, energy harvesting, bio and fluidics, Inertial and Resonant sensors, other sensors & actuators

Technical Program Committee

• Knut AASMUNDTVEIT, HBV Buskerud and Vestfold University College, Norway
• Arturo AYON, Univ. of Texas at San Antonio, USA
• Alain BOSSEBOEUF, IEF/CNRS-Université Paris-Sud, France
• Victor BRIGHT, Univ. of Colorado Boulder, USA
• Henri CAMON, LAAS-CNRS, France
• Kuo-Shen CHEN, National Cheng-Kung University, Taiwan
• Franck CHOLLET, Inst. FEMTO-ST / Univ. Franche-Comté, France
• Giorgio DE PASQUALE, DIMEAS, Politecnico di Torino, Italy
• Péter FURJES, Institute for Technical Physics and Materials Science, Hungary
• Alexandra GARRAUD, University of Florida, USA
• Sébastien HENTZ, CEA, France
• Kristin IMENES, HBV, Norway
• Toshihiro ITOH, Nat. Inst. of Advanced Industrial Science and Technology, Japan
• Elie LEFEUVRE, Université Paris Sud - CNRS, France
• Tie LI, SIMIT, CAS, China
• Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
• Souhil MEGHERBI, IEF/CNRS-Université Paris-Sud, France
• Raluca MULLER, IMT - Bucharest, Romania
• Anis Nurashikin NORDIN, International Islamic University, Malaysia
• Yves-Alain PETER, EPM, Montréal, Canada
• Emanuela PROIETTI, CNR-IMM Roma, Italy
• Marta RENCZ, BME, Budapest, Hungary
• Vladimir SOBOLEV, South Dakota School of Mines and Technology, USA
• John TUDOR, University of Southampton, UK
• Dong F. WANG, Jilin Univ., Changchun, China
• Zhenfeng WANG, SIMTech, Singapore
• Hsiharng YANG, National Chung Hsing Univ., Taiwan
• Jian ZHU, Nanjing Electronic Devices Institute, China